NTISthis.com

Evidence Guide: MEA263 - Modify/repair aircraft component multi-layer printed circuit boards

Student: __________________________________________________

Signature: _________________________________________________

Tips for gathering evidence to demonstrate your skills

The important thing to remember when gathering evidence is that the more evidence the better - that is, the more evidence you gather to demonstrate your skills, the more confident an assessor can be that you have learned the skills not just at one point in time, but are continuing to apply and develop those skills (as opposed to just learning for the test!). Furthermore, one piece of evidence that you collect will not usualy demonstrate all the required criteria for a unit of competency, whereas multiple overlapping pieces of evidence will usually do the trick!

From the Wiki University

 

MEA263 - Modify/repair aircraft component multi-layer printed circuit boards

What evidence can you provide to prove your understanding of each of the following citeria?

Inspect multi-layer printed circuit cards and associated components

  1. Relevant maintenance documentation, including component defect reports where applicable, is interpreted and matched by part and serial number
  2. Preparation of work area and circuit card assemblies is appropriate to allow for effective detailed inspection of all substrate, circuit tracks, edge connectors and attached components, taking into account any static discharge procedures
  3. Circuit card assemblies are visually or physically inspected for physical integrity of substrate, circuit tracks, edge connectors and attached components
  4. Modification status is established to assist in determining repair requirements
  5. Defects are correctly identified and reported
Relevant maintenance documentation, including component defect reports where applicable, is interpreted and matched by part and serial number

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Preparation of work area and circuit card assemblies is appropriate to allow for effective detailed inspection of all substrate, circuit tracks, edge connectors and attached components, taking into account any static discharge procedures

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Circuit card assemblies are visually or physically inspected for physical integrity of substrate, circuit tracks, edge connectors and attached components

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Modification status is established to assist in determining repair requirements

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Defects are correctly identified and reported

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Test multi-layer printed circuit cards and associated components

  1. Circuit card assemblies are correctly prepared and connected to the appropriate test facility in accordance with approved procedures, or circuit card assemblies are correctly prepared and connected in situ to allow required test procedures to be performed
  2. Circuit card assemblies are functionally tested in accordance with normal trade practice and approved maintenance documentation for evidence of serviceability or malfunction
  3. Circuit card assemblies, attached hardware and electronic components are electronically and/or physically adjusted/aligned in accordance with maintenance manuals or other prescribed procedures
Circuit card assemblies are correctly prepared and connected to the appropriate test facility in accordance with approved procedures, or circuit card assemblies are correctly prepared and connected in situ to allow required test procedures to be performed

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Circuit card assemblies are functionally tested in accordance with normal trade practice and approved maintenance documentation for evidence of serviceability or malfunction

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Circuit card assemblies, attached hardware and electronic components are electronically and/or physically adjusted/aligned in accordance with maintenance manuals or other prescribed procedures

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Troubleshoot multi-layer printed circuit cards and associated components

  1. Maintenance documentation, physical inspection and test results are used, where applicable, to assist in fault determination
  2. Maintenance manual fault diagnosis guides, logical processes and test equipment are used appropriately to ensure efficient and accurate troubleshooting
  3. Component faults are located and the causes of the faults are clearly identified and recorded in maintenance documentation, where required
  4. Rectification requirements are determined
Maintenance documentation, physical inspection and test results are used, where applicable, to assist in fault determination

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Maintenance manual fault diagnosis guides, logical processes and test equipment are used appropriately to ensure efficient and accurate troubleshooting

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Component faults are located and the causes of the faults are clearly identified and recorded in maintenance documentation, where required

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Rectification requirements are determined

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Dismantle multi-layer printed circuit cards and associated components

  1. Conformal/protective coatings are removed from the circuit card assembly to the extent required to effect necessary repairs and in accordance with maintenance manuals, industry or enterprise standards as applicable
  2. Appropriate work health and safety (WHS) requirements are observed at all times during maintenance procedures and applicable material safety data sheets (MSDS) and personal protective equipment (PPE) are used
  3. Circuit card assembly is dismantled to the extent necessary to allow repair of all identified faults
  4. Parts for processing are correctly tagged and despatched
  5. Parts for retention and re-fitment are correctly packaged and stored in accordance with approved procedures to avoid physical and electrostatic damage
  6. Parts for disposal are correctly packaged and processed to accord with statutory requirements pertaining to dangerous goods
Conformal/protective coatings are removed from the circuit card assembly to the extent required to effect necessary repairs and in accordance with maintenance manuals, industry or enterprise standards as applicable

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Appropriate work health and safety (WHS) requirements are observed at all times during maintenance procedures and applicable material safety data sheets (MSDS) and personal protective equipment (PPE) are used

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Circuit card assembly is dismantled to the extent necessary to allow repair of all identified faults

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Parts for processing are correctly tagged and despatched

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Parts for retention and re-fitment are correctly packaged and stored in accordance with approved procedures to avoid physical and electrostatic damage

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Parts for disposal are correctly packaged and processed to accord with statutory requirements pertaining to dangerous goods

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Assemble multi-layer printed circuit cards and associated components

  1. Parts removed for access, and replacement parts, are collected ensuring appropriate modification status, component tolerances and assembly configuration is maintained
  2. Any conformal/protective coatings removed are replaced to the approved standard of the equipment manufacturer, or industry standard, as appropriate
  3. Rework techniques are in accordance with industry approval procedures and relevant WHS precautions are observed and applicable MSDS and items of PPE are used
  4. Printed circuit card and associated components are assembled in accordance with maintenance manuals, and all electrical joints meet the approved standard of the equipment manufacturer, or industry standard, as appropriate
  5. Circuit substrate material, circuit tracks, edge connectors and through-hole eyelets are reworked, as necessary, to restore printed circuit card to a serviceable condition
Parts removed for access, and replacement parts, are collected ensuring appropriate modification status, component tolerances and assembly configuration is maintained

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Any conformal/protective coatings removed are replaced to the approved standard of the equipment manufacturer, or industry standard, as appropriate

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Rework techniques are in accordance with industry approval procedures and relevant WHS precautions are observed and applicable MSDS and items of PPE are used

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Printed circuit card and associated components are assembled in accordance with maintenance manuals, and all electrical joints meet the approved standard of the equipment manufacturer, or industry standard, as appropriate

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Circuit substrate material, circuit tracks, edge connectors and through-hole eyelets are reworked, as necessary, to restore printed circuit card to a serviceable condition

Completed
Date:

Teacher:		 Evidence:

 

 

 

 

 

 

 

Assessed

Teacher: ___________________________________ Date: _________

Signature: ________________________________________________

Comments:

 

 

 

 

 

 

 

 

Instructions to Assessors

Evidence Guide

Elements describe the essential outcomes.

Performance criteria describe the performance needed to demonstrate achievement of the element.

1.

Inspect multi-layer printed circuit cards and associated components

1.1

Relevant maintenance documentation, including component defect reports where applicable, is interpreted and matched by part and serial number

1.2

Preparation of work area and circuit card assemblies is appropriate to allow for effective detailed inspection of all substrate, circuit tracks, edge connectors and attached components, taking into account any static discharge procedures

1.3

Circuit card assemblies are visually or physically inspected for physical integrity of substrate, circuit tracks, edge connectors and attached components

1.4

Modification status is established to assist in determining repair requirements

1.5

Defects are correctly identified and reported

2.

Test multi-layer printed circuit cards and associated components

2.1

Circuit card assemblies are correctly prepared and connected to the appropriate test facility in accordance with approved procedures, or circuit card assemblies are correctly prepared and connected in situ to allow required test procedures to be performed

2.2

Circuit card assemblies are functionally tested in accordance with normal trade practice and approved maintenance documentation for evidence of serviceability or malfunction

2.3

Circuit card assemblies, attached hardware and electronic components are electronically and/or physically adjusted/aligned in accordance with maintenance manuals or other prescribed procedures

3.

Troubleshoot multi-layer printed circuit cards and associated components

3.1

Maintenance documentation, physical inspection and test results are used, where applicable, to assist in fault determination

3.2

Maintenance manual fault diagnosis guides, logical processes and test equipment are used appropriately to ensure efficient and accurate troubleshooting

3.3

Component faults are located and the causes of the faults are clearly identified and recorded in maintenance documentation, where required

3.4

Rectification requirements are determined

4.

Dismantle multi-layer printed circuit cards and associated components

4.1

Conformal/protective coatings are removed from the circuit card assembly to the extent required to effect necessary repairs and in accordance with maintenance manuals, industry or enterprise standards as applicable

4.2

Appropriate work health and safety (WHS) requirements are observed at all times during maintenance procedures and applicable material safety data sheets (MSDS) and personal protective equipment (PPE) are used

4.3

Circuit card assembly is dismantled to the extent necessary to allow repair of all identified faults

4.4

Parts for processing are correctly tagged and despatched

4.5

Parts for retention and re-fitment are correctly packaged and stored in accordance with approved procedures to avoid physical and electrostatic damage

4.6

Parts for disposal are correctly packaged and processed to accord with statutory requirements pertaining to dangerous goods

5.

Assemble multi-layer printed circuit cards and associated components

5.1

Parts removed for access, and replacement parts, are collected ensuring appropriate modification status, component tolerances and assembly configuration is maintained

5.2

Any conformal/protective coatings removed are replaced to the approved standard of the equipment manufacturer, or industry standard, as appropriate

5.3

Rework techniques are in accordance with industry approval procedures and relevant WHS precautions are observed and applicable MSDS and items of PPE are used

5.4

Printed circuit card and associated components are assembled in accordance with maintenance manuals, and all electrical joints meet the approved standard of the equipment manufacturer, or industry standard, as appropriate

5.5

Circuit substrate material, circuit tracks, edge connectors and through-hole eyelets are reworked, as necessary, to restore printed circuit card to a serviceable condition

Required Skills and Knowledge

Elements describe the essential outcomes.

Performance criteria describe the performance needed to demonstrate achievement of the element.

1.

Inspect multi-layer printed circuit cards and associated components

1.1

Relevant maintenance documentation, including component defect reports where applicable, is interpreted and matched by part and serial number

1.2

Preparation of work area and circuit card assemblies is appropriate to allow for effective detailed inspection of all substrate, circuit tracks, edge connectors and attached components, taking into account any static discharge procedures

1.3

Circuit card assemblies are visually or physically inspected for physical integrity of substrate, circuit tracks, edge connectors and attached components

1.4

Modification status is established to assist in determining repair requirements

1.5

Defects are correctly identified and reported

2.

Test multi-layer printed circuit cards and associated components

2.1

Circuit card assemblies are correctly prepared and connected to the appropriate test facility in accordance with approved procedures, or circuit card assemblies are correctly prepared and connected in situ to allow required test procedures to be performed

2.2

Circuit card assemblies are functionally tested in accordance with normal trade practice and approved maintenance documentation for evidence of serviceability or malfunction

2.3

Circuit card assemblies, attached hardware and electronic components are electronically and/or physically adjusted/aligned in accordance with maintenance manuals or other prescribed procedures

3.

Troubleshoot multi-layer printed circuit cards and associated components

3.1

Maintenance documentation, physical inspection and test results are used, where applicable, to assist in fault determination

3.2

Maintenance manual fault diagnosis guides, logical processes and test equipment are used appropriately to ensure efficient and accurate troubleshooting

3.3

Component faults are located and the causes of the faults are clearly identified and recorded in maintenance documentation, where required

3.4

Rectification requirements are determined

4.

Dismantle multi-layer printed circuit cards and associated components

4.1

Conformal/protective coatings are removed from the circuit card assembly to the extent required to effect necessary repairs and in accordance with maintenance manuals, industry or enterprise standards as applicable

4.2

Appropriate work health and safety (WHS) requirements are observed at all times during maintenance procedures and applicable material safety data sheets (MSDS) and personal protective equipment (PPE) are used

4.3

Circuit card assembly is dismantled to the extent necessary to allow repair of all identified faults

4.4

Parts for processing are correctly tagged and despatched

4.5

Parts for retention and re-fitment are correctly packaged and stored in accordance with approved procedures to avoid physical and electrostatic damage

4.6

Parts for disposal are correctly packaged and processed to accord with statutory requirements pertaining to dangerous goods

5.

Assemble multi-layer printed circuit cards and associated components

5.1

Parts removed for access, and replacement parts, are collected ensuring appropriate modification status, component tolerances and assembly configuration is maintained

5.2

Any conformal/protective coatings removed are replaced to the approved standard of the equipment manufacturer, or industry standard, as appropriate

5.3

Rework techniques are in accordance with industry approval procedures and relevant WHS precautions are observed and applicable MSDS and items of PPE are used

5.4

Printed circuit card and associated components are assembled in accordance with maintenance manuals, and all electrical joints meet the approved standard of the equipment manufacturer, or industry standard, as appropriate

5.5

Circuit substrate material, circuit tracks, edge connectors and through-hole eyelets are reworked, as necessary, to restore printed circuit card to a serviceable condition

Evidence required to demonstrate competency in this unit must be relevant to and satisfy all of the requirements of the elements and performance criteria under the specified conditions of assessment, and must include:

applying relevant WHS practices

using approved repair procedures and processes relating to multi-layer circuit cards

recognising unacceptable soldered connections, damaged circuit card components, circuit tracks integrity, substrate damage and edge connector condition

applying static-safe work area practices

reworking unacceptable printed circuit board soldered connections via acceptable de-soldering and soldering techniques

disassembling and assembling printed circuit board cards to approved industry standards and prescribed specifications

performing printed circuit board tests using relevant test equipment and processes to isolate printed circuit board track faults and assess serviceability state post repair

correctly disassembling, preparing repair area, reworking the card to industry standards, replacing faulted components and assembling card for post-repair inspection and testing

It is essential that substrate abrasion and rebuilding techniques and precautions associated with handling and assembly of electrostatic and temperature sensitive devices are fully observed, understood and complied with. A high level of awareness of safety precautions associated with beryllium materials and use of fluxes and solvents is to be demonstrated.

Evidence of transferability of skills and knowledge related to multi-layer printed circuit card assembly and repair is essential before undertaking any action. This may be demonstrated through application of the techniques involved across a representative range of circuit card substrate materials and attached components. Use of high precision, high reliability soldering techniques and handling of components, including application of anti-static equipment, must be demonstrated.

Evidence required to demonstrate competency in this unit must be relevant to and satisfy all of the requirements of the elements and performance criteria and include knowledge of:

component operation

basic principles/functions relating to electrical and electronic components on printed circuit boards

substrate materials

types of conformal coating

types of soldering equipment and solders used in track repair and component assembly

de-soldering techniques

optical equipment and tools used in multi-layer printed circuit board repair

how to obtain MSDS

WHS procedures

relevant maintenance manuals

relevant regulatory requirements and standard procedures.

Range Statement

This field allows for different work environments and conditions that may affect performance. Essential operating conditions that may be present (depending on the work situation, needs of the candidate, accessibility of the item, and local industry and regional contexts) are included.

Circuit card attached components include:

Capacitors, resistors, wires, semiconductors, inductors, transformers, switches, connectors, multi-pin ICs, terminal posts and heat-sink materials, and will include electrostatic sensitive devices

Procedures and standards include:

Procedures and standards for repair of printed circuit card assemblies, including a range of general engineering hand skills in addition to specific high reliability soldering skills.

Standards applicable in a given situation will be defined by equipment manufacturers and/or regulatory authorities and the enterprise